Machine de réparation pour composants de surface BGA (Ball Grid Array).
Permet de dessouder, nettoyer, ressouder un gros composant BGA. Pour une réparation de soudure, un changement de chip, l’installation d’une sonde pour analyse du signal en fonctionnement par exemple.
1.HD Optical alignment system for precisely mounting BGA and components
2.Touch screen and PLC controlling to ensure it work stably and reliably.
3.Components mounting accuracy within 0.01mm , Repair success rate 99.9%
4.Laser Positioning function for fast positioning the BGA Chip and motherboard
5.Precise Temperature Control, accuracy within 2
6. Upper temperature zone can be moved freely, Second zone can be adjusted up and down.
7. Three temperature zones to heat up independently.
8. Hot air nozzle can be rotated in 360 degree
9.Perfect support Soldering, Desoldering, Removing and Reballing the BGA Chip
10. Rework BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc
11. With CE certification, double over temperature protection function
Demande de réservation
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